| Standard No. |
Title |
Price(USD) |
Delivery |
Status |
Add To Cart |
| SJ 21447-2018 |
Specification for cadmium selenide monocrystal of CdSe-N-T01 used for infrared solid state laser |
315 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21343-2018 |
Measuring methods for microwave components and devices's scattering parameter at cryogenic temperature |
135 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21289-2018 |
Specification of embedded components capacitor materials for printed circaiit boards |
360 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 20749A-2018 |
Specification for copper-clad PTFE woven Mass fabric laminate for microwave circuit |
330 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21489-2018 |
Specification for electric heating shielding glass for display screen |
240 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21536-2018 |
Specification of gallium arsenide epitaxial wafer for microwave power devices and monolithic microwave integrated circuits |
165 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21534-2018 |
Specification of gallium nitride epitaxial wafer for microwave power transistor |
255 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21293-2018 |
Specification of photoimageable etching and plating resist ink |
|
via email in
1 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| SJ 21286-2018 |
Specification for fabric woven from glass for printed circuit boards |
255 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21288-2018 |
Specification of embedded component resistive materials for printed circuit boards |
255 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21287-2018 |
Specification for resin coated copper foil of HDI printed circuit board |
285 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21535-2018 |
Specification of silicon carbide epitaxial wafer for power electronic device |
|
via email in
1 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| SJ 21256-2018 |
Technological verincation procedures for film sputtering equipment |
|
via email in
1 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| SJ 21486-2018 |
Specification for hydrosphere sealing composite conductive rubber strip |
210 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ/Z 21340-2018 |
Design guideline for superconducting filter |
345 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21348-2018 |
Environment test methods for superconducting devices |
225 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21344-2018 |
Test methods for superconducting filters |
|
via email in
1 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| SJ 21476-2018 |
Technical requirements for annealing of InP single crystal |
135 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21290-2018 |
Technical requirements of carbide drills for printed circuit boards |
165 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21334-2018 |
Ceramic packages and metal packages Technical requirements for nickel electroplating process |
|
via email in
1 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
|
|
