| Standard No. |
Title |
Price(USD) |
Delivery |
Status |
Add To Cart |
| SJ/T 11749-2019 |
|
|
via email in
1 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| SJ/T 11750-2019 |
|
|
via email in
1 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| SJ 21294-2018 |
Performace specification for embedded passive devices printed circuit boards |
195 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21431-2018 |
General requ针ements of ergonomical modeling for military electronic equipment |
255 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21455-2018 |
Integrated circuit ceramic package- Technical requirements for sealing process with alloy-sintering |
255 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21260-2018 |
Technological verification procedures for metal-organic chemical vapor deposition(MOCVD)equipment |
255 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21259-2018 |
Technological verification procedures for polishing equipment |
240 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 58119/3-2018 |
Semiconductor optoelectronic devices Detail specification for photodetector of GT322D-60-SM-FCIAPC |
300 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21493-2018 |
Test method of surface defects for silicon carbide epitaxial wafers |
195 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 58119/2-2018 |
Semiconductor optoelectronic devices Detail specifceation for InGaAs photodiode of GD3562T |
300 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21441-2018 |
Specification for high purity semi-insulating silicon carbide monocrystalline wafers of SiC-HPSI |
255 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ/Z 21354-2018 |
Design guidelines for assemblability of SiP products |
195 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ/Z 21355-2018 |
Design guidelines for hermetic package of SiP products |
195 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ/Z 21356-2018 |
Design guidelines for flip chip bonding process of SiP products |
255 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ/Z 21357-2018 |
Design guidelines for chip stacking process of SiP products |
195 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21420-2018 |
General requirements for hardware architecture of software defined radio |
195 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21418-2018 |
Terminology of software defined radio |
375 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21419-2018 |
General requirements for reconfiguration of software defined radio |
135 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21422-2018 |
General requirements for integration bus of software defined radio |
195 (USD) |
via email in
1 business day
|
VALID
|
|
| SJ 21424-2018 |
General requirements for data transmission format of software defined radio |
480 (USD) |
via email in
1 business day
|
VALID
|
|
|
|
