| Standard No. |
Title |
Price(USD) |
Delivery |
Status |
Add To Cart |
| GB/T 33922-2017 |
Wafer level test methods for MEMS piezoresistive pressure-sensitive die performances |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 32815-2016 |
Silicon-based MEMS fabrication technology—Specification for criterion of the bulk silicon piezoresistance process |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 38446-2020 |
Micro-electromechanical system technology—Test methods for tensile property measurement of strip thin films |
 (USD) |
via email in
1-3 business day
|
TO BE VALID
|
|
| GB/T 12842-1991 |
Terminology for film integrated circuits and hybrid film integrated circuits |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 32814-2016 |
Silicon-based MEMS fabrication technology—Specification for criterion of the SOI wafer based MEMS process |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 15876-1995 |
Specification of leadframes for plastic quad flat package |
|
via email in
1-3 business day
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB 7092-1986 |
|
 (USD) |
via email in
1-5 business day
|
ABOLISHED
|
|
| GB/T 16466-1996 |
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 15138-1994 |
Case outlines for film integrated circuits and hybrid integrated circuits |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| SJ 20954-2006 |
Integrated circuits latch-up test |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 38762.1-2020 |
Geometrical product specifications(GPS)—Dimensional tolerancing—Part 1:Linear sizes |
 (USD) |
via email in
1-8 business day
|
TO BE VALID
|
|
| GB/T 35010.2-2018 |
Semiconductor die products—Part 2:Exchange data formats |
 (USD) |
via email in
1-8 business day
|
VALID
|
|
| GB/T 26111-2010 |
Micro-electromechanical system technology—Terms |
 (USD) |
via email in
1-5 business day
|
VALID
|
|
| GB/T 14113-1993 |
Terminology of packages for semiconductor integrated circuits |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 28274-2012 |
Silicon-based MEMS fabrication technology—The basic regulation of layout design |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 17023-1997 |
Semiconductor devices Integrated circuits--Part 2:Digital integrated circuits Section two—Family specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU |
|
via email in
1-3 business day
|
VALID
|
please email coc@codeofchina.com for quotation
|
| GB/T 26113-2010 |
Micro-electromechanical system technology—General rules for the assessment of micro-geometrical parameters |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| GB/T 35005-2018 |
Test methods for flip chip integrated circuits |
 (USD) |
via email in
1-3 business day
|
VALID
|
|
| ZB L 55001-1989 |
|
|
via email in
|
ABOLISHED
|
please email coc@codeofchina.com for quotation
|
| GB 9178-1988 |
Terminology for integrated circuits |
 (USD) |
via email in
1-10 business day
|
VALID
|
|
|
|
