| Standard No. |
Title |
Price(USD) |
Delivery |
Status |
Add To Cart |
| HB/Z 5095.3-2004 |
Methods for analysis of cyaniding plating brass solutions -- Part 3: Determination of sodium carbonate content by potentiometric titrimetric method |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5089.1-2004 |
Methods for analysis of plating black nickel solutions |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5071-2004 |
Process and quality inspection for electroless nickel plating |
240 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5089.3-2004 |
Methods for analysis of plating black nickel solutions-Part 3:Continual determination of nickel sulfate and zinc sulfate content by EDTA compleximetric method |
60 (USD) |
via email in
1 business day
|
ABOLISHED
|
|
| HB/Z 5095.1-2004 |
Methods for analysis of cyaniding plating brass solutions -- Part 1: Continual determination of copper (II) cyanate and zinc oxide content by EDTA volumetric method |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5087.5-2004 |
Methods for analysis of acid plating copper solutions part 5:Determination of nickel sulfate content by atomic absorption spectrometric method |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5094.1-2004 |
Methods for analysis of acid plating tin solutions -- Part 1: Determination of tin (II) sulfate content by potentiometric titrimetric method |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5087.3-2004 |
Methods for analysis of acid plating copper solutions part 3:Determination of sulphuric acid content by potentiometric titrimetric method |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5094.2-2004 |
Methods for analysis of acid plating tin solutions -- Part 2: Determination of free sulphuric acid content by potentiometric titrimetric method |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5087.7-2004 |
Methods for analysis of acid plating copper solutions part 7:Determination of antimony content by atomic absorption spectrometric method |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5094.3-2004 |
Methods for analysis of acid plating tin solutions -- Part 3: Determination of lead content by atomic absorption spectrometric method |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5096.2-2004 |
Methods for analysis of plating lead solutions -- Part 2: Determination of free fluorboric acid content by potentiometric titrimetric method |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5087.2-2004 |
Methods for analysis of acid plating copper solutions part 2:Determination of copper sulfate content by potentiometric titrimetric method |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5087.4-2004 |
Methods for analysis of acid plating copper solutions part 4:Determination of iron content by atomic absorption spectrometric method |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5094.4-2004 |
Methods for analysis of acid plating tin solutions -- Part 4: Determination of copper content by atomic absorption spectrometric method |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5087.1-2004 |
Methods for analysis of acid plating copper solutions |
60 (USD) |
via email in
1 business day
|
VALID
|
|
| HB/Z 5087.6-2004 |
Methods for analysis of acid plating copper solutions part 6:Determination of arsenic content by spectrophotometric method |
90 (USD) |
via email in
1 business day
|
VALID
|
|
| HB 7751-2004 |
Testing method for the bonding strength for the coating made by detonation-gun spraying |
120 (USD) |
via email in
1 business day
|
VALID
|
|
| QJ 2220.5-1994 |
Test Method for Electrical Insulation Properties of Coating - Measurement of Dielectric Loss Tangent at Power Frequency, Audio Frequency and High Frequency |
45 (USD) |
via email in
1 business day
|
VALID
|
|
| QJ 2220.4-1994 |
Test Method for Electrical Insulation Properties of Coating - Measurement of Relative Dielectric Constant at Power Frequency, Audio Frequency and High Frequency |
60 (USD) |
via email in
1 business day
|
VALID
|
|
|
|
