Copper wire for semiconductor lead bonding

YS/T 678-2008 Copper wire for semiconductor lead bonding
Standard No.:	YS/T 678-2008	Status:	VALID remind me the status change Email:
Target Language:	English	File Format:	PDF
Word Count:	8000 words	Translation Price:	240 (USD) remind me the price change Email:
Implemented on:	2008-09-01	Delivery:	via email in 1-3 business day
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Standard No.:	YS/T 678-2008
Chinese Name:	半导体器件键合用铜丝
English Name:	Copper wire for semiconductor lead bonding
Professional Classification:	H61 Light metals and their alloys
Professional Classification:	YS Professional Standard - Non-ferrous Metal
ICS Classification:	77.150.10 Aluminium products
Issued by:
Issued on:	2008-03-12
Implemented on:	2008-09-01
Status:	VALID
Target Language:	English
File Format:	PDF
Word Count:	8000 words
Translation Price:	240 (USD)
Delivery:	via email in 1-3 business day

YS/T 678-2008 The following standards are cited：

YS/T 678-2008 Cited by the following standards：