Thermal design of printed board assemblies

SJ/Z 2808-1987 Thermal design of printed board assemblies
Standard No.:	SJ/Z 2808-1987	Status:	SUPERSEDED remind me the status change Email:
Target Language:	English	File Format:	PDF
Word Count:	6000 words	Translation Price:	180 (USD) remind me the price change Email:
Implemented on:	1988-01-01	Delivery:	via email in 1 business day
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Standard No.:	SJ/Z 2808-1987
Chinese Name:	印制板组装件热设计
English Name:	Thermal design of printed board assemblies
Professional Classification:	P01 Technical management
Professional Classification:	SJ Professional Standard - Electronics
Issued by:	MIIT
Issued on:	1987-06-05
Implemented on:	1988-01-01
Status:	SUPERSEDED
Replace By:	SJ/Z 2808-2015
Replace By Date:
Target Language:	English
File Format:	PDF
Word Count:	6000 words
Translation Price:	180 (USD)
Delivery:	via email in 1 business day

SJ/Z 2808-1987 The following standards are cited：

SJ/Z 2808-1987 Cited by the following standards：