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Position: Standard Detail Info
SJ/T 10626-1995 Method for determining impurities in gold wire for semiconductor lead bonding by ICP-AES
Standard No.: SJ/T 10626-1995 Status: VALID remind me the status change
Target Language: English File Format: PDF
Word Count: 2500 words Translation Price: 75 (USD) remind me the price change
Implemented on: 1995-10-01 Delivery: via email in 1-3 business day
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Standard No.: SJ/T 10626-1995
Chinese Name: 键合金丝中杂质素的ＩＣＰ－ＡＥＳ测定方法
English Name: Method for determining impurities in gold wire for semiconductor lead bonding by ICP-AES
Professional Classification: A01 Technical Management
Professional Classification: SJ Professional Standard - Electronics
Issued by:
Issued on: 1995-04-22
Implemented on: 1995-10-01
Status: VALID
Target Language: English
File Format: PDF
Word Count: 2500 words
Translation Price: 75 (USD)
Delivery: via email in 1-3 business day
SJ/T 10626-1995 The following standards are cited：
SJ/T 10626-1995 Cited by the following standards：
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